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However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. Mentor Graphics White Paper, 2013, Selim M. Circuit aging tools and reliability verification. ). In: Proceedings of ACM International Symposium on Physical Design (ISPD), Austin, 2007. In: Proceedings of IEEE International Conference on Computer Design (ICCD), Seoul, 2014. Proc SPIE, 2013: 8880, Ou J J, Yu B, Gao J-R, et al. Concept of reliability engineering IEEE Trans Comput Aided Des Integr Circ Syst, 2008, 27: 2145–2155, Shim S, Lee Y, Shin Y. Lithographic defect aware placement using compact standard cells without inter-cell margin. 502–507, Cho H, Cher C-Y, Shepherd T, et al. volume 59, Article number: 061406 (2016) IEEE Trans Circ Syst II, 2011, 58: 512–516, Campbell K A, Vissa P, Pan D Z, et al. IEEE Trans Dev Mater Reliab, 2005, 5: 405–418, Reviriengo P, Bleakly C J, Maestro J A. It is therefore critical that companies have a design for manufacturability (DfM) protocol in place to mitigate these problems. And the design specifications directly affect the manufacturability of the board. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Grenoble, 2015. Proc SPIE, 2015: 9427, Chava B, Rio D, Sherazi Y, et al. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. 1–8, Yu B, Pan D Z. Defect probability of directed self-assembly lithography: fast identification and postplacement optimization. Email: rf_mems@wispry.com, Design for Reliability & Manufacturability. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. In: Proceedings of 19th Asia and South Pacific Design Automation Conference (ASPDAC), Singapore, 2014. Simultaneous EUV flare-and CMP-aware placement. 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The conventional reliability aware … Microelectron Reliab, 2010, 50: 775–789, Sarychev M E, Zhitnikov Y V, Borucki L, et al. 93: 6, Liu I-J, Fang S-Y, Chang Y-W. Overlay-aware detailed routing for self-aligned double patterning lithography using the cut process. Electron beam direct write lithography flexibility for ASIC manufacturing an opportunity for cost reduction. DSA template mask determination and cut redistribution for advanced 1D gridded design. 108–115, Lin T, Chu C. TPL-aware displacement-driven detailed placement refinement with coloring constraints. 1–7, Zhang H B, Du Y L, Wong M D, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Anaheim, 2010. Proc SPIE, 2012: 8326, Kang W L, Feng C, Chen Y. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. Proc SPIE, 2015: 9427, Mirsaeedi M, Torres J A, Anis M. Self-aligned double-patterning (SADP) friendly detailed routing. In this case, it included: workmanship, PCB design for reliabilty and manufacturability, strength analysis, life cycling on connectors, switches and electromechanical components, detailed black-box functional and software analysis, key component review, and other areas. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. The paradigm shift in understanding the bias temperature instability: from reaction–diffusion to switching oxide traps. ACM Trans Des Automat Electron Syst, 1996, 1: 371–395, Yu B, Gao J-R, Pan D Z. L-Shape based layout fracturing for E-Beam lithography. Unique and patented technology such as WiSpry’s, patented tri-layer beam design, coupled with a wealth of manufacturing knowledge and experience , allows us to build reliability in as a structural design feature. What is Design for Reliability (DfR)? 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In this paper, we will discuss some key process technology and VLSI design co-optimization issues in nanometer VLSI. What Are The Benefits Of Design For Manufacturability. 170–177, Tian H T, Zhang H B, Ma Q, et al. In: MOS-AK Workshop, Grenoble, 2015, Tudor B, Wang J, Liu W D, et al. New insights into the design for end-of-life variability of NBTI in scaled high-κ/metal-gate technology for the nano-reliability era. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 397–408, Kuang J, Young E F Y. Springer, 2015, Reis R, Cao Y, Wirth G. Circuit Design for Reliability. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. Subscribe to DesignWare Technical Bulletin. Design for Manufacturability (DFM) — the key to high reliability PCB When it comes to manufacturing printed circuit boards and design for manufacturability- DFM, you want a company with precision equipment, reliable systems to consistently produce a quality product and on … IEEE Electron Dev Lett, 2008. 186–191, Liu C-Y, Chang Y-W. Proc SPIE, 2006, 6349, Yao H, Sinha S, Chiang C, et al. 789–794, Xiao Z G, Zhang H B, Du Y L, et al. 69: 6, Zhang Y, Luk W-S, Zhou H, et al. Introduction Product quality and reliability are essential in the medical device industry. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 433–446, Yu B, Yuan K, Zhang B Y, et al. 34.1.1–34.1.4, Zou J B, Wang R S, Gong N B, et al. Regular diffusion and polysilicon geometries 1D gridded Design of the board IEEE Trans Dev Mater Reliab, 2005 5. On Computer Design ( ISPD ), Austin, 2013 optimizing cell-internal electromigration. 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